RK2206
Cortex-M4F Up To 200MHz
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Rockchip RK2206 Cortex-M4F Up To 200MHz
Tensilica HiFi3 DSP Up To 300MHz
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Product Highlights:
- Processor: Cortex-M4F Core Operating at Up to 200MHz
- Digital Signal Processor: Tensilica HiFi3 DSP Achieving Up to 300MHz
- Display Interface: MCU/SPI for LCD Connection
- Memory Configuration: Integrated 256KB SRAM, 192KB DTCM, 8/4 MB Internally Stored Flash, 8/4 MB PSRAM, with Support for EMMC and SD/MMC Cards
- Connectivity Options: Built-in Power Management (with-in RK812), DVP Sensor Interface, USB 2.0 OTG, SPI, UART, I2C, PDM, I2S
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Matching package
Rockchip RK2206
Key features
- Cortex-M4F Up To 200MHz
- Tensilica HiFi3 DSP Up To 300MHz
- Built-in 448K Byte SRAM & DTCM
- Embedded 8M/4M Byte FLASH & PSRAM
- WLAN 802.11 b/g/n
The Rockchip RK2206 is an energy-efficient, high-integration standalone microcontroller unit designed for wireless communication tasks. It is suitable for various sectors such as Internet of Things (IoT), wearable devices, home automation, and cloud connectivity. The device features a Cortex-M4F core with instruction and data cache, enabling the operation of an operating system and applications.
Additionally, a Cortex-M0 core equipped with I/D cache handles WLAN MAC stack functions. An integrated HiFi3 DSP supports audio processing and smart voice interaction algorithms. The inclusion of 480KB system memory and an eXecute In Place (XIP) Flash/pSRAM interface offers flexibility in development. Multiple chip package (MCP) options with varying on-chip Flash and pSRAM capacities are available based on application needs.
The module also supports 802.11b/g/n WLAN protocols with a complete Medium Access Control (MAC) solution, incorporating an integrated Power Amplifier (PA), transmit/receive switch, Balun, and Low-Noise Amplifier (LNA) to minimize bill of materials costs. It’s optimized for high throughput performance in open office settings, ensuring smooth internet connectivity. Furthermore, automatic hardware calibration assists in tuning RF characteristics to achieve optimal RF performance, preventing RF performance degradation due to hardware variations.
DETAIL SPEC
CPU | Cortex-M4F Up To 200MHz |
DSP | Tensilica HiFi3 DSP Up To 300MHz |
Memory | Built-in 256KB SRAM, 192KB DTCM |
Built-in 8/4 MB Flash | |
Built-in 8/4 MB PSRAM | |
Supports EMMC, SD/MMC Card | |
Audio ADC | 3CH Audio-ADC,1CH Audio-DAC (With-in RK812) |
Class D Audio PA(With-in RK812) | |
Connectivity | Built-in Power Management(With-in RK812) |
DVP Sensor Interface | |
USB2.0 OTG, SPI, UART, I2C, PDM, I2S | |
Display | MCU/SPI LCD Interface |
Audio | Multi-format audio encoder & decoder |
OS | Free RTOS |